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Performance of low cost PBGA package for 10 Gb/s applications

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2 Author(s)
Xingling Zhou ; Agere Syst., Allentown, PA, USA ; Fang, N.J.

Electrical characterization data are presented in this paper to demonstrate a low cost, mid-I/O range plastic ball grid array (PBGA) package as an effective packaging solution for 10 Gb/s applications such as SONET/SDH and Ethernet.

Published in:

Electrical Performance of Electronic Packaging, 2002

Date of Conference:

21-23 Oct. 2002