Referenced Items are not available for this document.
100 μm thin 2-mm-by-3-mm GaAs dice with via holes have been successfully bonded on alumina substrates using the technique of gold-tin multilayer composite. The bondings are near perfect, as confirmed by a scanning acoustic microscope. Scanning electron microscope images of cross sections reveal that the bonding layers are very uniform and the thickness is 1.5 μm. EDX analysis shows that the composition of the bonding layer is nearly gold-tin eutectic. No die crackings were observed after the bonding. The specimens underwent 40 cycles of thermal shock test between -196°C and 160°C without incurring bonding degradation and die cracking
Published in:
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
(Volume:14
,
Issue:
4
)
Date of Publication: Dec 1991
- Page(s):
- 874 - 878
- ISSN :
- 0148-6411
- INSPEC Accession Number:
- 4084143
- Digital Object Identifier :
- 10.1109/33.105148
- Product Type:
- Journals & Magazines
- Date of Current Version :
- 06 August 2002
- Issue Date :
- Dec 1991
- Sponsored by :
- IEEE Components, Packaging, and Manufacturing Technology Society
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