Thermal cycling induced plastic deformation in solder joints. II. Accumulated deformation in through hole joints

For pt.I see ASME Trans. J. Electron. Pack., vol.113, no.1, p.8-15 (March 1991). A thermal cycled pin-through-hole solder joint is modeled with finite element analysis using nonlinear elastic/plastic plus creep behavior. The large shift of the pins and the deformation of the solder are predicted with the model to be the result of the accumulated plastic deformation in the solder and the results correlated with experimental observations. Thermal cycling fatigue life predictions based on uniform shear, unchanged joint geometry, and the Coffin-Manson equation are found deficient for dealing with the complex deformation mechanism of pin-through-hole solder joint thermal fatigue.<
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