Cart (Loading....) | Create Account
Close category search window
 

Dust test results on multicontact circuit board connectors

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
DeNure, D.G. ; AT&T Bell Labs., Whippany, NJ, USA ; Sproles, E., Jr.

A study to determine if the normal force of a connector is a factor in maintaining a low contact resistance after an accumulation of dust in the pins and receptacles is discussed. A dust mixture of hygroscopic salts and natural mineral particles was used. The test connectors included the standard 2-mm connector with a nominal normal force of 0.55 N, a special 2-mm connector with an extra low normal force of 0.35 N, and another connector with a normal force of about 1.5 N. Resistance values, as compared with values measured before the dust exposure, increased by less than 4 mΩ for the contact pair showing the largest increase. The results indicate that the lower normal force in high-density connectors does not adversely affect the ability of the connector system to tolerate particulate contaminants

Published in:

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:14 ,  Issue: 4 )

Date of Publication:

Dec 1991

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.