By Topic

Advanced ceramic substrates for multichip modules with multilevel thin film interconnects

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
B. C. Foster ; Vitramon Inc., Bridgeport, CT, USA ; F. J. Bachner ; E. S. Tormey ; M. A. Occhionero
more authors

Two ceramic materials systems, cofired 99.6% alumina/tungsten and aluminum nitride, are presented as options for use as multichip modules bases. The 99.6% alumina system addresses the limitations of conventional 90-94% alumina systems by providing ±0.2% dimensional control combined with a smooth, defect-free surface. The 99.6% alumina/tungsten system exhibits an enhanced flexural strength. The injection-molded aluminum nitride produced using the binderless injection molding process is characterized by an average thermal conductivity of 230 W/mK with a standard deviation of 7.3. The controlled microstructure of the AlN material results in a smooth, defect-free surface after lapping and polishing for thin film compatibility. Precise dimensional tolerance control of ±0.2% for substrate features such as cavities or through holes is provided

Published in:

IEEE Transactions on Components, Hybrids, and Manufacturing Technology  (Volume:14 ,  Issue: 4 )