By Topic

An optically-coupled high-voltage p-n-p-n crosspoint array

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)

A solid-state crosspoint array compatible with electromechanical switches has been developed in order to realize high-performance telephone exchange networks. The optically-coupled high breakover voltage crosspoint array discussed in this paper has achieved complete isolation of the speech path from the triggering circuit while it can be triggered directly by a transistor-transistor logic (TTL) level signal from the control circuit. The crosspoint array has a unique photo-coupling structure which allows four p-n-p-n elements to be triggered effectively by only one LED, maintaining up to 200 V/0.1 /spl mu/s dv/dt characteristics. It provides breakover voltage of up to 450 V, gate trigger LED current less than 20 mA, ON-state resistance within 4.5 /spl Omega/ and OFF-state capacitance less than 7 pF. The matrix arrangement is a 1/spl times/4 configuration; it is composed of a two wire bidirectional circuit and packaged in a 16-pin ceramic DIP. These device characteristics make possible the realization of solid-state crosspoint array practically compatible with the conventional electromechanical switch, particularly meeting requirements of miniaturization, low-power dissipation, and inexpensive construction. Accordingly, direct interface with conventional telephone sets is possible.

Published in:

Solid-State Circuits, IEEE Journal of  (Volume:14 ,  Issue: 6 )