Referenced Items are not available for this document.
A multipurpose, multipad pitch test die with pad pitches ranging from 5 mil down to 3 mil, suitable for evaluating gold-ball bonding, aluminum wedge bonding, tape automated bonding (TAB), array bonding, wafer probes, and molding operations is discussed. The author reviews the design features of this test die and presents the statistical design of the experiment strategy taken in developing a wire bond process for very fine pitch assembly based on this test die. The effect of major bonding parameters on bond ball shear force is discussed. A statistical method for predicting the ball shorting rate is compared with assembly yield data
Published in:
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
(Volume:14
,
Issue:
4
)
Date of Publication: Dec 1991
- Page(s):
- 680 - 690
- ISSN :
- 0148-6411
- INSPEC Accession Number:
- 4078821
- Digital Object Identifier :
- 10.1109/33.105117
- Product Type:
- Journals & Magazines
- Date of Current Version :
- 06 August 2002
- Issue Date :
- Dec 1991
- Sponsored by :
- IEEE Components, Packaging, and Manufacturing Technology Society
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