By Topic

Planar multilevel interconnection technology employing a polyimide

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)

A planar multilevel interconnection technology, called planar metallization with polymer (PMP), has been developed, which utilizes a polyimide known as PIQ (polyimide isoindroquinazoline-dione) as an interlevel dielectric. The PIQ is highly resistant to heat and is mechanically flexible. Its low impurity concentrations also make it very stable in semiconductors. The PMP processing techniques have been refined to the stage where ICs can be fabricated commercially. A PIQ film etchant forms fine via-holes up to 3×3 μm/SUP 2/, and chip size can be reduced by placing bonding pads on the active region of the device. Highly reliable linear and 256-bit bipolar memory ICs have been realized through this technology.

Published in:

IEEE Journal of Solid-State Circuits  (Volume:13 ,  Issue: 4 )