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Microminiature solid-state imaging system utilizing hybrid LSI techniques

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3 Author(s)

The authors describe the design, construction, and performance characteristics of a low-resolution 50×80 element solid-state imaging system that has been fabricated using multichip large-scale integration. Techniques used to fabricate the substrate that contains 117 MOS and low-power bipolar integrated circuits plus the 4000-element phototransistor mosaic sensor array are discussed. Also, the methods used to mount and provide interdevice signal paths, including the use of advanced multilayer flexible interconnection techniques are shown.

Published in:

Solid-State Circuits, IEEE Journal of  (Volume:5 ,  Issue: 5 )

Date of Publication:

Oct 1970

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