By Topic

Microminiature solid-state imaging system utilizing hybrid LSI techniques

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)

The authors describe the design, construction, and performance characteristics of a low-resolution 50×80 element solid-state imaging system that has been fabricated using multichip large-scale integration. Techniques used to fabricate the substrate that contains 117 MOS and low-power bipolar integrated circuits plus the 4000-element phototransistor mosaic sensor array are discussed. Also, the methods used to mount and provide interdevice signal paths, including the use of advanced multilayer flexible interconnection techniques are shown.

Published in:

Solid-State Circuits, IEEE Journal of  (Volume:5 ,  Issue: 5 )