Skip to Main Content
Technology evolutions in logic and memory through increased integration, combined with potential improvements in machine organization, should provide processor performance in the mid 1970's that exceeds the second generation benchmark (IBM 7090) by a factor of 1000. Serious problems of packaging require a greater system designer sensitivity to the electrical and physical properties of materials, as well as requiring a closer tie between the technologist, system designer, and software designer. The increased processor speeds also create a balancing problem as the processor input- output gap widens, and LSI could assist in the solution of this problem. This paper discusses some of the technology- dependent parameters that could permit predicted performances to be achieved.