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Modeling of multilayered power distribution planes using transmission matrix method

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2 Author(s)
Joong-Ho Kim ; Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA ; Swaminathan, M.

This paper presents a method for analyzing multilayered rectangular and irregular shaped power distribution planes in the frequency and time domain. The analysis includes the effect of vias on the power distribution network. The planes are modeled using a two dimensional array of distributed RLCG circuit elements. Planes are connected in parallel using vias, which are modeled as self and mutual inductors. For the computation of the power distribution impedances at specific points in the network, a multiinput and multioutput transmission matrix method has been used. This is much faster than Spice and requires smaller memory. Using the transmission matrix method, via effects and the effects of multiple rectangular power/ground plane pairs without and with decoupling capacitors have been analyzed for realistic structures.

Published in:

Advanced Packaging, IEEE Transactions on  (Volume:25 ,  Issue: 2 )