Cart (Loading....) | Create Account
Close category search window
 

Domain edge formation and jitter characteristics in thermomagnetic recording with magnetic field modulation

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Cheng, D.C. ; IBM Res. Div., San Jose, CA, USA ; McDaniel, T.W. ; Davis, C.R.

The role of the dynamics of the magnetic bias field in field modulation thermomagnetic recording has been studied experimentally and through computer simulation. Using a continuous-wave, focused laser to heat a magnetooptic recording medium, the magnitude and the spatial gradient of the modulated bias field were varied, and the behavior of medium noise and jitter in magnetooptic recording was measured. The experimental measurements yielded a universal curve for the relation between signal pulse jitter and the spatial gradient of the recording bias field. Micromagnetics simulations provided insight into the connection between bias field magnitude and its spatial gradient and the degree of domain wall irregularity in recorded marks

Published in:

Magnetics, IEEE Transactions on  (Volume:26 ,  Issue: 5 )

Date of Publication:

Sep 1990

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.