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Wafer-level defect-based testing using enhanced voltage stress and statistical test data evaluation

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5 Author(s)
M. Quach ; Agilent Labs., Agilent Technol. Co., Fort Collins, CO, USA ; Tuan Pham ; T. Figal ; B. Kopitzke
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In this paper, we illustrate the effectiveness of wafer-level enhanced voltage stress (EVS) along with low voltage sweep (LVS), IDDQ and other parametric tests to screen early life failure defects. Our experiment shows temporary undetected defects after repeated exposure to certain applied voltages. We demonstrate a statistical methodology to screen die with suspected early life failure defects.

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Test Conference, 2002. Proceedings. International

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