Wafer-level defect-based testing using enhanced voltage stress and statistical test data evaluation

In this paper, we illustrate the effectiveness of wafer-level enhanced voltage stress (EVS) along with low voltage sweep (LVS), I/sub DDQ/ and other parametric tests to screen early life failure defects. Our experiment shows temporary undetected defects after repeated exposure to certain applied voltages. We demonstrate a statistical methodology to screen die with suspected early life failure defects.