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Vacuum packaging technology using localized aluminum/silicon-to-glass bonding

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5 Author(s)
Cheng, Y.-T. ; Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA ; Wan-Tai Hsu ; Najafi, K. ; Nguyen, C.T.-C.
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A glass vacuum package based on localized aluminum/silicon-to-glass bonding has been successfully demonstrated. A constant heat flux model shows that heating can be confined locally in the dielectric layer underneath a microheater as long as the width of the microheater and the thickness of silicon substrate are much smaller than the die size and a good heat sink is placed underneath the silicon substrate. With 3.4 W heating power, ∼0.2 MPa applied contact pressure and 90 min wait time before bonding, vacuum encapsulation at 25 mtorr (∼3.33 Pa) can be achieved. Folded-beam comb drive μ-resonators are encapsulated and used as pressure monitors. Long-term testing of vacuum-packaged p-resonators with a Quality Factor (Q) of 2500 has demonstrated stable operation after 69 weeks. A μ-resonator with a Q factor of ∼9600 has been vacuum encapsulated and shown to be stable after 56 weeks.

Published in:

Microelectromechanical Systems, Journal of  (Volume:11 ,  Issue: 5 )