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Packaging of micro-optic components to meet Telcordia standards

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4 Author(s)
McLeod, R.R. ; JDS Uniphase, San Jose, CA, USA ; Wolkin, M. ; Morozov, V. ; Sawyer, K.A.

We have presented a design sequence for optomechanical components that is applied early in the design stage to candidate joint designs and epoxy selections in order to rapidly select those that meet reliability requirements such as shock, vibration, temperature cycling, and damp heat. Finite element simulations are used to establish failure limits for each joint at extremes of mechanical and thermal stress. Direct measurements of component motion and bond failure limits after each environmental stress are compared to the FEA results to determine the reliability margins. In our experience, such techniques make it possible to pass Telcordia qualifications without iteration.

Published in:

Optical Fiber Communication Conference and Exhibit, 2002. OFC 2002

Date of Conference:

17-22 Mar 2002