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Finite size substrate and ground plane effects on propagation characteristics of planar interconnections

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2 Author(s)
Kergonou, G. ; Inst. Nat. des Sci. Appliques, Rennes, France ; Drissi, M.

The groundplane and substrate finitudes are examined on the propagation characteristics of planar interconnections using the finite element method. The observed effects, for both truncations, are quantified and explained for the microstrip, coplanar waveguide (CPW) and stripline structures.

Published in:
Electromagnetic Compatibility, 2002. EMC 2002. IEEE International Symposium on  (Volume:2 )

Date of Conference: 19-23 Aug. 2002

Page(s):
701 - 704 vol.2
Print ISBN:
0-7803-7264-6
INSPEC Accession Number:
7509768
Conference Location :
Minneapolis, MN, USA
Digital Object Identifier :
10.1109/ISEMC.2002.1032678
Product Type:
Conference Publications

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