By Topic

Enhanced immunity against crosstalk and EMI using GHz twisted differential line structure on PCB

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Dong Gun Kam ; Div. of EE, KAIST, Daejeon, South Korea ; Heeseok Lee ; Seungyong Baek ; Bongcheol Park
more authors

There is a growing tendency to adopt a differential signaling scheme for critical signals. To support differential signaling, differential transmission lines are required. The concept of twisted pair on the cable interconnection can be readily applied to differential transmission lines on printed circuit boards (PCBs), which enables enhanced immunity against crosstalk and radiated emission. The new differential transmission line called twisted differential line (TDL) has been introduced. In this paper the enhanced immunity of TDL against crosstalk and radiated emission is clearly demonstrated with both simulation and measurement. TDL is compared with other differential transmission lines showing its superiority. Moreover several ideas to improve the performance of TDL are proposed and verified to be useful. Offset-TDL (O-TDL) improves crosstalk immunity further and vertical-TDL (V-TDL) enables reduced routing area while maintaining performance.

Published in:

Electromagnetic Compatibility, 2002. EMC 2002. IEEE International Symposium on  (Volume:2 )

Date of Conference:

19-23 Aug. 2002