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FEA contact element technique and its applications in metal lead forming failure analysis

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1 Author(s)
Lam Tim Fai ; Adv. Micro Devices (Singapore), Singapore, Singapore

FEA contact element technique has been established and was successfully applied to metal lead forming simulation. One of the commonly encountered lead finish defects, the lead shift problem, was studied in more detail. The results clearly show that the lead shift is due to the unsymmetrical profile of the lead frame used. The FEA results are in good accordance with the experimental measurement.

Published in:
Physical and Failure Analysis of Integrated Circuits, 2002. IPFA 2002. Proceedings of the 9th International Symposium on the

Date of Conference: 2002

Page(s):
47 - 50
Print ISBN:
0-7803-7416-9
INSPEC Accession Number:
7480304
Digital Object Identifier :
10.1109/IPFA.2002.1025610
Product Type:
Conference Publications

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