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Optimized desoak system for IC panel test handlers

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3 Author(s)
Pfahnl, A.C. ; Teradyne Inc, Bedford, MA, USA ; Dunn, J., Jr. ; Muller, L.A.

This paper presents a unique airflow-based thermal system that returns thermally conditioned integrated circuit (IC) devices to a near ambient temperature level. This "desoak" thermal system addresses specific requirements of new IC panel (lead frame and strip) test handlers, which have very high peak processing capabilities and can operate stand-alone or in-line. Analyses are presented for estimating the heating and cooling loads, and the IC device temperature response. Temperature control methods are described that help minimize the system size. The hardware design is detailed along with experimental data that verifies the cooling capacity of the system.

Published in:

Electronics Packaging Manufacturing, IEEE Transactions on  (Volume:25 ,  Issue: 2 )

Date of Publication:

Apr 2002

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