By Topic

New structure of silica-based planar lightwave circuits for low-power thermooptic switch and its application to 8 × 8 optical matrix switch

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

7 Author(s)
R. Kasahara ; NTT Photonics Labs., Ibaraki, Japan ; M. Yanagisawa ; T. Goh ; A. Sugita
more authors

We propose a novel structure that reduces the switching power of a silica-based thermooptic switch (TOSW). The structure consists of silicon trenches and heat insulating grooves, which are formed beneath and beside the arms of a Mach-Zehnder interferometer, respectively. We optimize the structure using the differential-element method (DEM) and fabricate a 2 × 2 TOSW with a switching power of only 90 mW, namely, 75% less than that of a conventional TOSW. We also obtain an insertion loss of about 1 dB and an extinction ratio of over 30 dB with a response time from 0% to 90% of 4.9 ms. We then use the structure to fabricate an 8 × 8 matrix switch and confirm a total power consumption of 1.4 W with an average insertion loss of 7.4 dB and an extinction ratio of 50.4 dB for 64 possible optical paths

Published in:

Journal of Lightwave Technology  (Volume:20 ,  Issue: 6 )