Cart (Loading....) | Create Account
Close category search window
 

Automatic measurement system for degradation analysis in thin-film AlCu metallizations

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Catelani, M. ; Dipt. di Elettronica e Telecomunicazioni, Universita di Firenze, Florence, Italy ; Nicoletti, R.

Microelectronic devices are required to have high reliability when subjected to stresses within the maximum ratings. Nevertheless, in multilayered integrated circuits (ICs) several degradation phenomena can generate failures. In this paper, the degradation process in thin-film AlCu metallizations by means of the thermal stress test is taken into account. To this aim, an automatic measurement system with programmable performances is designed and realized in order to induce thermal degradation and compute data. The measurement system can be easily replicated with simple equipment and user-friendly LabView software

Published in:

Instrumentation and Measurement, IEEE Transactions on  (Volume:51 ,  Issue: 3 )

Date of Publication:

Jun 2002

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.