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Automatic measurement system for degradation analysis in thin-film AlCu metallizations

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2 Author(s)
Catelani, M. ; Dipt. di Elettronica e Telecomunicazioni, Universita di Firenze, Florence, Italy ; Nicoletti, R.

Microelectronic devices are required to have high reliability when subjected to stresses within the maximum ratings. Nevertheless, in multilayered integrated circuits (ICs) several degradation phenomena can generate failures. In this paper, the degradation process in thin-film AlCu metallizations by means of the thermal stress test is taken into account. To this aim, an automatic measurement system with programmable performances is designed and realized in order to induce thermal degradation and compute data. The measurement system can be easily replicated with simple equipment and user-friendly LabView software

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Instrumentation and Measurement, IEEE Transactions on  (Volume:51 ,  Issue: 3 )