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Half-conductive coupling interconnection technology for digital transmission between CMOS chips

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6 Author(s)
Devisch, F. ; Vrije Univ., Brussels, Belgium ; Maillard, X. ; Wei Pan ; De Tandt, C.
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This paper describes how to use half-conductive coupling (HC-coupling) to obtain digital interconnections between two flip-chip standard CMOS integrated circuits. For process simplicity, the HC-layer can be unpatterned and the CMOS chips do not require any post-processing steps. Measurements of a complete HC-coupling, digital communication link show reliable operation up to 100 Mb/s channel speed. The two flipped prototype CMOS chips were fabricated in 0.8-μm, 5-V CMOS. The I/O pads' pitch was 150 μm

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Advanced Packaging, IEEE Transactions on  (Volume:25 ,  Issue: 1 )