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The use of laminate multichip modules for the packaging of 9-GHz digital multichip circuits

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5 Author(s)
D. J. Schwab ; Special Purpose Processor Dev. Group, Mayo Found., Rochester, MN, USA ; B. Randall ; P. J. Zabinski ; T. M. Schaefer
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An investigation of the high-frequency performance of laminate multichip module (MCM-L) technology was undertaken with the goal of demonstrating its appropriateness for the development of digital radar receivers operating in the X band (8 to 12 GHz). A seven-chip circuit using digital components on a Gore MCM-L was successfully tested up to 9.6 GHz. An analog-to-digital converter on an MCM-L was successfully tested up to 6 GHz. An extensive characterization of the MCM-L technology using both simulations and measurements was performed to formulate a set of design guidelines for high-frequency applications. A novel dielectric-encapsulated MCM-to-MCM interconnect scheme was proposed and tested

Published in:

IEEE Transactions on Advanced Packaging  (Volume:25 ,  Issue: 1 )