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Packaging design support environment-a simulation system for analysis of VLSI interconnects

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4 Author(s)
Whipple, T.D. ; VLSI Technol., Tempe, AZ, USA ; Rozenblit, J.W. ; Prince, J.L. ; Palusinski, O.A.

An X-windows-based simulation environment has been developed for the prediction of electrical characteristics of integrated circuit packaging structures. This program, called packaging design support environment (PDSE), applies simulation management techniques to drive several tools that make the calculations. Two tools calculate inductance and capacitance for multiconductor, multidielectric, two-dimensional structures, with lossy dielectrics. A third tool uses these parameters to compute pulse response characteristics of multiple coupled, uniform, lossless transmission lines terminated at discrete points with R, L, and C elements. The design process in PDSE proceeds in three major phases: modeling, simulation, and evaluation. These processes are interactive and allow the designer to refine a design model, modify experiments, and apply various evaluation procedures

Published in:

Computers and Communications, 1990. Conference Proceedings., Ninth Annual International Phoenix Conference on

Date of Conference:

21-23 Mar 1990