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FLO/STRESS: an integrated software module to predict stress in electronic products

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8 Author(s)
Bailey, C. ; Centre for Numerical Modelling & Process Anal., Univ. of Greenwich, London, UK ; Warner, M. ; Agha, A. ; Pericleous, K.
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Software technology that predicts stress in electronic systems and packages, developed as part of TCS Programme, is described. The software is closely integrated within a thermal design tool providing the ability to simulate the coupled effects of airflow, temperature and stress on product performance. This integrated approach to analysis will help decrease the number of design cycles.

Published in:

Computing & Control Engineering Journal  (Volume:13 ,  Issue: 3 )