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Browse Journals & Magazines > Computing & Control Engineeri ...> Volume:13 Issue:3 Help

FLO/STRESS: an integrated software module to predict stress in electronic products

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8 Author(s)
Bailey, C. ; Centre for Numerical Modelling & Process Anal., Univ. of Greenwich, London, UK ; Warner, M. ; Agha, A. ; Pericleous, K.
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Software technology that predicts stress in electronic systems and packages, developed as part of TCS Programme, is described. The software is closely integrated within a thermal design tool providing the ability to simulate the coupled effects of airflow, temperature and stress on product performance. This integrated approach to analysis will help decrease the number of design cycles.

Published in:
Computing & Control Engineering Journal  (Volume:13 ,  Issue: 3 )

Date of Publication: June 2002

Page(s):
143 - 148
ISSN :
0956-3385
INSPEC Accession Number:
7326084
Digital Object Identifier :
10.1049/cce:20020306
Date of Current Version :
07 August 2002
Issue Date :
June 2002
Sponsored by :
IET

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