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MEMS (micro electromechanical systems) have been developed based on silicon bulk micromachining. Wafer process packaging was applied to an electrostatically levitated rotational gyroscope and a micro relay. High density electrical feedthrough made by glass deep RIE and metal electroplating enabled an array MEMS as multiprobe data storage and contactor for LSI probing. Fine diameter fiber optic sensors for pressure and NSOM (near field scanning optical microscope) sensor applications were developed. The hydrogen storage capacity of a carbon nanotube was measured using the resonant frequency shift of a thin silicon cantilever.