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Design rule methodology to improve the manufacturability of the copper CMP process

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3 Author(s)
S. Lakshminarayanan ; Process Technol. Dev., Santa Clara, CA, USA ; P. Wright ; J. Pallinti

A systematic approach to generate design rules and layout guidelines for damascene metal layers that enhance the robustness and manufacturability of designs is presented. The intra-die sheet resistance variation due to line width and pattern density effects is characterized for single and multi-level interconnects and the feature interaction distance is determined to be about 30 μm. It is shown that the best way to minimize the sheet resistance spread is by implementing rules for the minimum and maximum space between any two features as a function of their widths.

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Interconnect Technology Conference, 2002. Proceedings of the IEEE 2002 International

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