IEEE.org| IEEE Xplore Digital Library| IEEE Standards| IEEE Spectrum| More Sites

Cart (Loading....) | Create Account | 

Close category search window
Author Searchbeta |  Advanced Search  |  Preferences |  Search Tips  |  More Search Options  
 
Browse Conference Publications > Interconnect Technology Confe ... Help

Evaluation and analysis for mechanical strengths of low k dielectrics by a finite element method

Full Text Sign-In or Purchase

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing! close button
puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Aoi, N. ; Semicond. Technol. Res. Dept., Assoc. of Super-Adv. Electron. Technol., Kanagawa, Japan ; Fukuda, T. ; Yanazawa, Hiroshi

We evaluated elastic modulus of various porous and nonporous inorganic low-k films by means of a nano-indentation. The elastic modulus of various low-k films shows a linear dependence on the film density for porous and nonporous inorganic low-k materials, respectively. We have studied the effect of pore aggregation on the elastic modulus of thin films by the finite element method (FEM) using the 2-dimensional random pore generation model. The FEM results for the elastic modulus, which were calculated for the 2-dimensional random pore model, fit extremely well with the experimental data obtained by the nano-indentation method.

Published in:
Interconnect Technology Conference, 2002. Proceedings of the IEEE 2002 International

Date of Conference: 2002

Page(s):
72 - 74
Print ISBN:
0-7803-7216-6
INSPEC Accession Number:
7411968
Digital Object Identifier :
10.1109/IITC.2002.1014891
Product Type:
Conference Publications

IEEE Account

Purchase Details

Profile Information

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.