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We report high fmax and high current InP/InGaAs/InP DHBT in transferred-substrate technology. The common base device with equivalent emitter size of 128 μm2 exhibits fmax of 330 GHz at a current of 100 mA. The common emitter device with emitter area of 64 μm2 shows fmax of 371 GHz when biased at 57 mA. The breakdown voltage of these DHBTs is up to 7 V at low current density. All the devices are realized in multi-finger structure that was deliberately designed to improve the thermal stability at high power operation and to reduce the parasitics. To our knowledge, this is the highest fmax for a DHBT biased at such high current.