By Topic

CFD analysis of automatic test equipment

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
V. R. Gaurav ; Credence Syst. Corp., Hillsboro, OR, USA ; G. Laird

This paper documents a successful methodology to model complex systems that require simultaneous system and board level thermal/fluid interactions. First, a CAD model integrating the board and system level geometry was created using Autodesk Inventor 4.0. This CAD model was then imported into a CFD Solver. The CFD solver used was CFDesign 4.1, a finite element fluid flow and heat transfer solver. CFDesign's ability to import geometry using any industry-standard format and quickly prepare it for simulation was the key to creating a CFD model that accurately predicts both system and board level thermal performance concurrently. By employing the above CAD and CFD tools in concert with experimentally validated assumptions, chip junction temperatures were accurately predicted as well as their sensitivities to system level characteristics.

Published in:

Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on

Date of Conference: