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A semi-lumped balun fabricated by low temperature co-fired ceramic

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2 Author(s)
Ching-Wen Tang ; Phycomp Taiwan Ltd., Kaohsiung, Taiwan ; Chi-Yang Chang

A new chip-type multi-layer ceramic balun is presented in this paper. This balun is designed in the ISM band and fabricated using low temperature co-fired ceramic (LTCC) technology. It involves the semi-lumped concept and the multi-layer structure to realize the LTCC-MLC balun. The symmetric structure provides the excellent characteristics of phase balance and amplitude balancing. Measured results of the LTCC-MLC balun match well with the computer simulation.

Published in:

Microwave Symposium Digest, 2002 IEEE MTT-S International  (Volume:3 )

Date of Conference:

2-7 June 2002

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