Referenced Items are not available for this document.
This paper presents an IC package and bonding wire modeling software which generates an equivalent lumped circuit model from physical information of IC package and bonding wires. The resulting model takes into account the effects of frequency-dependent resistance, capacitance, as well as self and mutual inductance. The accuracy of the modeling approach has been verified using a 20-pin lead-less plastic chip carrier package. Furthermore, the application of the IC package characterization software to the design of a 700 MHz CMOS VCO has also been demonstrated.
Published in:
Microwave Symposium Digest, 2002 IEEE MTT-S International
(Volume:3
)
Date of Conference: 2-7 June 2002
- Page(s):
- 2109 - 2112 vol.3
- Meeting Date :
- 02 Jun 2002-07 Jun 2002
- ISSN :
- 0149-645X
- Print ISBN:
- 0-7803-7239-5
- INSPEC Accession Number:
- 7322313
- Conference Location :
- Seattle, WA, USA
- Digital Object Identifier :
- 10.1109/MWSYM.2002.1012286
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