By Topic

Development of an organic wafer-level packaging platform for highly integrated RF transceivers

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Ramachandran, R. ; Holcombe Dept. of Electr. & Comput. Eng., Clemson Univ., SC, USA ; Pham, A.

We present the development of a novel organic-micromachined packaging scheme at the wafer level for highly integrated RF transceivers. This process enables the integration of on-chip passive devices and isolation structures at the wafer level. We demonstrate the development of inductors that achieve a Q-factor of about 61 at 1.7 GHz and on-chip isolation structures that provide an isolation of more than 50 dB in the GHz range.

Published in:

Microwave Symposium Digest, 2002 IEEE MTT-S International  (Volume:3 )

Date of Conference:

2-7 June 2002