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Development of an organic wafer-level packaging platform for highly integrated RF transceivers

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2 Author(s)
R. Ramachandran ; Holcombe Dept. of Electr. & Comput. Eng., Clemson Univ., SC, USA ; A. Pham

We present the development of a novel organic-micromachined packaging scheme at the wafer level for highly integrated RF transceivers. This process enables the integration of on-chip passive devices and isolation structures at the wafer level. We demonstrate the development of inductors that achieve a Q-factor of about 61 at 1.7 GHz and on-chip isolation structures that provide an isolation of more than 50 dB in the GHz range.

Published in:

Microwave Symposium Digest, 2002 IEEE MTT-S International  (Volume:3 )

Date of Conference:

2-7 June 2002