Cart (Loading....) | Create Account
Close category search window
 

W-band flip-chip interconnects on thin-film substrate

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Schmuckle, F.J. ; Ferdinand-Braun-Inst., Berlin, Germany ; Jentzsch, A. ; Oppermann, H. ; Riepe, K.
more authors

A flip-chip approach is presented using a thin-film microstrip line (TFMSL) on silicon as the carrier substrate. Thin-film technology allows one to employ cheap low-resistivity Si wafers without degrading MM-wave performance. By means of 3D EM simulation, an optimized interconnect is designed for the 77 GHz band. Measurements of test structures up to 100 GHz demonstrate the potential of this approach.

Published in:

Microwave Symposium Digest, 2002 IEEE MTT-S International  (Volume:3 )

Date of Conference:

2-7 June 2002

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.