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C-band oscillator using high-Q inductors embedded in multi-layer organic packaging

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11 Author(s)
Yoon, S.-W. ; Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA ; Davis, M.F. ; Lim, K. ; Pinel, S.
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We present C-band oscillators with external high-Q inductors: wire-bond inductors and embedded inductors in a Multi-Layer Organic (MLO) board fabricated by a thick-film MCM-L technology. The phase-noise performance of oscillators is compared with the oscillator using on-chip inductors. Inductors are designed to obtain high quality factor in C-band. The phase-noise performance of the oscillator with on-chip inductors measures -108 dBc/Hz at 600 kHz offset frequency, and that of the oscillator with external inductors shows -113 dBc/Hz at the same offset. Using MLO inductors, the phase-noise is better than the oscillator with on-chip inductors and comparable to the oscillator with wire-bond inductors. To our knowledge, this is the first C-band oscillator using inductors embedded in the multi-layer organic packaging technology. This is also the first report comparing the performance of oscillators using three different inductor technologies: on-chip integration, wire-bonding, and multi-layer organic packaging technology.

Published in:

Microwave Symposium Digest, 2002 IEEE MTT-S International  (Volume:2 )

Date of Conference:

2-7 June 2002