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A simple simulation method for analyzing substrate coupling effects is proposed. In this method, a substrate network model is extracted from the layout data, and analyses are carried out by using a circuit simulator under a conventional CAD environment. Test chips were fabricated in order to demonstrate the effectiveness of this proposed method. Simulation results were compared with the measured results. These comparisons showed the validity of the proposed simulation method.
Circuits and Systems, 2002. ISCAS 2002. IEEE International Symposium on (Volume:4 )
Date of Conference: 2002