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Reliability of PBGA assemblies under out-of-plane vibration excitations

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6 Author(s)
Yang, Q.J. ; Gintic Inst. of Manuf. Technol., Singapore, Singapore ; Wang, Z.P. ; Lim, G.H. ; Pang, John H.L.
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Vibration testing of plastic ball grid array (PBGA) assemblies to assess the reliability of the solder joints under external vibration excitations was reported in this paper. The test vehicle was an assembly with four 256 I/Os PBGA modules assembled on a printed circuit board (PCB). During the test, the assembly was clamped at two opposite sides to a vibration shaker. It was found that the dynamic displacement of the assembly under external out-of-plane sinusoidal vibration excitations was highly nonlinear. In order to determine the reliability of the solder joints, the resistance of each module was continuously monitored during the test. Under an out-of-plane sweep sinusoidal excitation with a constant acceleration amplitude of 2.5 G within a narrow frequency band around the fundamental resonant frequency of the assembly, the first-time-to-failure and mean-time-to-failure of the solder joints were found to be 0.46 and 6.19 million vibration cycles respectively. The failed solder joints were at the corners of the PBGA module. Most failures were due to cracks near the copper pad on the PCB side

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Components and Packaging Technologies, IEEE Transactions on  (Volume:25 ,  Issue: 2 )