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The design of a microelectromechanical systems (MEMS) socket system to enable the temporary high density interconnection of a CMOS die to a System-on-Chip (SoC) implementation of a tester is described. Connectivity is achieved with a fixed MEMS socket that is thermosonically bonded to a CMOS tester die and a carrier MEMS socket that acts as a custom die-specific removable insert for the fixed socket to easily interface the die being tested to the SoC based tester. A new cantilevered bridge-type microspring contact provides direct connectivity to the I/O pads of the die under test. The bridge-type contact spring geometry has excellent elastic properties and features a contact resistance of 19.3 mΩ at a contact force of 1.35 mN. The MEMS socket system was designed and simulated using IntelliSuite CAD tools and fabrication arrangements are being pursued.
Circuits and Systems, 2002. ISCAS 2002. IEEE International Symposium on (Volume:1 )
Date of Conference: 2002