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A new land grid array (LGA) connector technology is presented that resolves many of the limitations of current LGA connector approaches. A novel design is used to produce Cu-alloy springs supported in a fully cross-linked polymer 'button'. This button acts as a reliable, high-frequency, low-profile connector element capable of handling high current densities. In addition, the mechanical and electrical properties of the button can be engineered to meet specific application requirements, for example low contact force for a large array, as demonstrated through modeling and experimental data.