Cart (Loading....) | Create Account
Close category search window

An adaptable, high performance LGA connector technology

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)

A new land grid array (LGA) connector technology is presented that resolves many of the limitations of current LGA connector approaches. A novel design is used to produce Cu-alloy springs supported in a fully cross-linked polymer 'button'. This button acts as a reliable, high-frequency, low-profile connector element capable of handling high current densities. In addition, the mechanical and electrical properties of the button can be engineered to meet specific application requirements, for example low contact force for a large array, as demonstrated through modeling and experimental data.

Published in:

Electronic Components and Technology Conference, 2002. Proceedings. 52nd

Date of Conference:


Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.