Cart (Loading....) | Create Account
Close category search window

Effect of copper oxide on the adhesion behavior of Epoxy Molding Compound-copper interface

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Chung, P.W.K. ; Dept. of Mech. Eng., Hong Kong Univ. of Sci. & Technol., Kowloon, China ; Yuen, M.M.F. ; Chan, Philip C.H. ; Ho, N.K.C.
more authors

During processing and qualification, packages are subjected to significant temperature changes. Thermal cycling test is commonly applied for reliability qualification to determine the ability of components and interconnects to withstand mechanical stresses induced. Thermal oxidation of metal surface, especially on copper leadframe, is unavoidable. In this study delamination between Epoxy Molding Compound (EMC) and copper leadframe is investigated using the button shear test and the X-ray Photoelectron Spectroscopy (XPS) technique. The button shear samples were subjected to thermal cycling in accordance to JEDEC standard. The shear test was conducted on the sample after the thermal cycling. A thin copper oxide film is formed on the leadframe across the EMC-leadframe interface after molding. The change in adhesion between oxide film and EMC has been investigated as a function of the thickness and the chemical content of the copper oxide by other investigators. The oxide thickness in the samples was extremely thin and did not reach the critical value reported in previous studies. The chemical composition is examined by the XPS technique after the shear test showing only cuprous oxide at the intact interfacial area, while both cuprous and cupric oxides were observed in other areas of the sample. The button shear test results showed an increase in critical shear force at the initial phase of the thermal cycling test followed by a gradual fall in value. The increase in shear force indicates that chemical in addition to mechanical factors are significant in thermal cycling. After analyzing both the button shear and XPS results, a linear relationship between the cuprous oxide content and the adhesion force is found. This leads to the observation that the change in interfacial adhesion is related to the growth of cuprous oxide content on the leadframe.

Published in:

Electronic Components and Technology Conference, 2002. Proceedings. 52nd

Date of Conference:


Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.