By Topic

Understanding modulus trends in ultra low K dielectric materials through the use of molecular modeling

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Iwamoto, N. ; StaR Center, Honeywell Electron. Mater., Sunnyvale, CA, USA ; Moro, L. ; Bedwell, B. ; Apen, P.

Molecular modeling has previously been used to study adhesion and surface energy effects of die attach, underfill and viafill formulations, and is currently being used to study the mechanical property trends of the new class of ultra low k nanoporous dielectric materials, NANOGLASS® porous spin-on-glass (SOG) and GX3-PTM porous organic, being developed within Honeywell. The need to understand material performance from a molecular level is especially understandable when considering the target application in IC fabrication. With such small microstructures, the impact of the molecular mechanical properties imparted by the molecular structure and architecture become more and more important. In addition, we are finding that by understanding the effects of the formulation on the mechanical properties from the molecular level, formulation changes can be planned directly targeted at specific properties. Although we are using many aspects of molecular modeling to help us understand SOG and organic dielectric properties such as density, wetting, solubility and adhesion, for this paper we have concentrated on reporting our observations on modulus. Our studies have found that we can correlate the experimental modulus of these materials very simply with a molecularly derived modulus.

Published in:

Electronic Components and Technology Conference, 2002. Proceedings. 52nd

Date of Conference: