Cart (Loading....) | Create Account
Close category search window
 

Generic, Direct-Chip-Attach MEMS packaging design with high density and aspect ratio Through-Wafer Electrical Interconnect

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Seong Joon Ok ; Adv. Assembly Process Technol. Lab., Georgia Inst. of Technol., Atlanta, GA, USA ; Neysmith, J. ; Baldwin, D.F.

Micro-Electro-Mechanical-Systems (MEMS) are integrated systems combining electrical and mechanical components, which are fabricated using integrated circuit (IC) batch processing techniques. The influence of MEMS is made possible through their benefits in functionality, size, and reliability. In spite of these remarkable and promising achievements in the field of microsystem fabrication, the commercialization of proven devices are lagged far behind expectations, considerably due to high packaging cost, improper packaging design solution and high testing cost. This paper is focused on suggesting and demonstrating a promising generic, modular, Direct-Chip-Attach (DCA), low cost and high reliable MEMS packaging design strategy and solution applying with high aspect ratio Through-Wafer Electrical Interconnect (TWEI). Fabrication of TWEI using dry etching is relatively new technology that can create more and better packaging options than any other conventional packaging design. The various techniques that can make through-wafer vias conductive are demonstrated and analyzed with advantages and drawbacks.

Published in:

Electronic Components and Technology Conference, 2002. Proceedings. 52nd

Date of Conference:

2002

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.