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Fabrication of 1.55 μm VCSELs on Si using metallic bonding

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4 Author(s)
H. C. Lin ; Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA ; W. H. Wang ; K. C. Hsieh ; K. Y. Cheng

Using AuGeNiCr multilayered metals as the wafer bonding medium, long-wavelength GaInAsP/InP vertical cavity surface emitting lasers employing Al-oxide/Si as the upper and lower distributed Bragg reflectors were fabricated on Si substrate with the bonding interface formed outside the vertical cavity surface emitting laser cavity. Laser emission at 1.545 μm was measured under pulsed operations near room temperature. The low-temperature metallic bonding process demonstrates a great potential in device fabrication

Published in:

Electronics Letters  (Volume:38 ,  Issue: 11 )