By Topic

A manufacturing perspective of physical design characterization

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
D. N. Maynard ; Microelectron. Div., IBM Corp., Essex Junction, VT, USA ; B. B. Reuter ; J. A. Patrick

Historically, physical design characterization (PDC) has been the focus of product or design engineers. This paper introduces PDC from a manufacturing perspective and the value of design-specific information for successful process control. Several PDC tools are described in terms of this integrated approach and the current embodiment at the IBM Microelectronics Vermont facility. Specifically, these tools include pattern density calculations, critical area extractions, and "swampfinding", a method for locating specific design-process sensitivities. The paper then develops both the technical and business strategies that leverage this information into the manufacturing processes. To clearly illustrate the concepts introduced, several examples of PDC results augmented with traditional characterization information, along with the ensuing manufacturing actions are reviewed. Finally, the larger picture of physical design characterization in manufacturing, and the impact upon development, are further developed.

Published in:

Advanced Semiconductor Manufacturing 2002 IEEE/SEMI Conference and Workshop

Date of Conference: