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Modeling and analysis of 96.5Sn-3.5Ag lead-free solder joints of wafer level chip scale package on buildup microvia printed circuit board

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2 Author(s)
J. H. Lau ; Agilent Technol. Inc., Palo Alto, CA, USA ; S. -W. R. Lee

In this study, time-temperature-dependent nonlinear analyses of lead-free solder bumped wafer level chip scale package (WLCSP) on microvia buildup printed circuit board (PCB) assemblies subjected to thermal cycling conditions are presented. The lead-free solder considered is 96.5Sn-3.5Ag. The 62Sn-2Ag-36Pb solder is also considered to establish a baseline. These two solder alloys are assumed to obey the Garofalo-Arrhenius steady-state creep constitutive law. The shear stress and shear creep strain hysteresis loops, shear stress history, shear creep strain history, and creep strain density range at the corner solder joint are presented for a better understanding of the thermal-mechanical behavior of the lead-free solder bumped WLCSP on microvia buildup PCB assemblies

Published in:

IEEE Transactions on Electronics Packaging Manufacturing  (Volume:25 ,  Issue: 1 )