Close category search window
 

On-demand multipath distance vector routing in ad hoc networks

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Marina, M.K. ; Dept. of Electr. & Comput. Eng. & Comput. Sci., Cincinnati Univ., OH, USA ; Das, S.R.

We develop an on-demand multipath distance vector protocol for mobile ad hoc networks. Specifically, we propose multipath extensions to a well-studied single path routing protocol known as ad hoc on-demand distance vector (AODV). The resulting protocol is referred to as ad hoc on-demand multipath distance vector (AOMDV). The protocol computes multiple loop-free and link-disjoint paths. Loop-freedom is guaranteed by using a notion of "advertised hopcount". Link-disjointness of multiple paths is achieved by using a particular property of flooding. Performance comparison of AOMDV with AODV using ns-2 simulations shows that AOMDV is able to achieve a remarkable improvement in the end-to-end delay-often more than a factor of two, and is also able to reduce routing overheads by about 20%.

Published in:
Network Protocols, 2001. Ninth International Conference on

Date of Conference: 11-14 Nov. 2001

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.