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High frequency characteristics of liquid crystal polymer for system in a package application

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4 Author(s)
Gang Zou ; Div. of Electron. Production, Chalmers Univ. of Technol., Goteborg, Sweden ; Gronqvist, H. ; Starski, P. ; Johan Liu

Liquid crystal polymer (LCP) is a promising substrate for electronics packaging. In this paper, the high frequency characteristics of LCP were investigated using a microstrip ring resonator to verify the possibility of the application of the material in microwave packaging. A GaAs MMIC switch circuit was fabricated using LCP as substrate to demonstrate an application of this material for system in a package. From the high frequency measurements, it is shown that LCP has low dielectric constant and low loss tangent that make it useable in high frequency packaging

Published in:
Advanced Packaging Materials, 2002. Proceedings. 2002 8th International Symposium on

Date of Conference: 2002

Page(s):
337 - 341
Meeting Date :
03 Mar 2002-06 Mar 2002
Print ISBN:
0-7803-7434-7
INSPEC Accession Number:
7335704
Conference Location :
Stone Mountain, GA
Digital Object Identifier :
10.1109/ISAPM.2002.990408
Product Type:
Conference Publications

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