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Inspection and Process evaluation for Flip Chip Bumping and CSP by scanning 3D confocal microscopy

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2 Author(s)
Schick, A. ; Electron. Assembly Syst., Siemens Dematic AG, Munich, Germany ; Kedziora, M.

Highly accurate true 3D-inspection of Flip Chip Bumping provides important hints and information for evaluation of research processes as well as for the introduction of new products. Quality assurance in production facilities also require optical inspection of every bump on every die on each wafer. For a long time optical methods e.g. triangulation based methods suffered from severe drawbacks or simply were to slow. Especially confocal optical techniques, well know for offering various unique characteristics such as high resolution, accuracy and reliability while being virtually free of optical artifacts, were to slow and not suitable for inline inspection applications. Siemens Dematic AG developed a high speed scanning 3D confocal microscope in order to overcome that drawbacks. While keeping all the advantages of this unique optical method the scanning 3D confocal microscope offers the ability to inspect even synchronous to production speeds

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Advanced Packaging Materials, 2002. Proceedings. 2002 8th International Symposium on

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