Cart (Loading....) | Create Account
Close category search window
 

Inspection and Process evaluation for Flip Chip Bumping and CSP by scanning 3D confocal microscopy

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Schick, A. ; Electron. Assembly Syst., Siemens Dematic AG, Munich, Germany ; Kedziora, M.

Highly accurate true 3D-inspection of Flip Chip Bumping provides important hints and information for evaluation of research processes as well as for the introduction of new products. Quality assurance in production facilities also require optical inspection of every bump on every die on each wafer. For a long time optical methods e.g. triangulation based methods suffered from severe drawbacks or simply were to slow. Especially confocal optical techniques, well know for offering various unique characteristics such as high resolution, accuracy and reliability while being virtually free of optical artifacts, were to slow and not suitable for inline inspection applications. Siemens Dematic AG developed a high speed scanning 3D confocal microscope in order to overcome that drawbacks. While keeping all the advantages of this unique optical method the scanning 3D confocal microscope offers the ability to inspect even synchronous to production speeds

Published in:

Advanced Packaging Materials, 2002. Proceedings. 2002 8th International Symposium on

Date of Conference:

2002

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.