Scheduled System Maintenance:
On May 6th, single article purchases and IEEE account management will be unavailable from 8:00 AM - 12:00 PM ET (12:00 - 16:00 UTC). We apologize for the inconvenience.
By Topic

The effect of initial growth layer on magnetic properties of Co-Cr films

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Kitakami, O. ; Hitachi-Maxell Ltd., Ibaraki, Japan ; Ogawa, Y. ; Fujiwara, H. ; Kugiya, F.
more authors

The effect of a Ti underlayer, which increases the perpendicular coercive force of Co-Cr films, was investigated. To clarify the cause of this phenomenon, the film-thickness dependence of the magnetic properties was examined. It was found that the coercive force of a Co-Cr film deposited directly on a polymide substrate decreases drastically when it becomes thinner than 50 nm, whereas in the case of Co-Cr film on a Ti underlayer, a high coercive force is maintained even when the film becomes as thin as 20 nm. The film with the underlayer has a distinct uniform columnar structure, whereas the film without it has a 50-nm-thick initial growth layer with no clear structure. Measurements of the temperature dependence of magnetic properties and observations of segregated microstructures indicate that the improvement of magnetic properties by the insertion of the Ti underlayer is mainly due to the improvement of shape anisotropy resulting from the formation of a distinctly segregated microstructure

Published in:

Magnetics, IEEE Transactions on  (Volume:24 ,  Issue: 6 )