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Comparison of various micro via technology

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3 Author(s)
Nishiwaki, T. ; IBIDEN Co. Ltd., Gifu, Japan ; Mikado, Y. ; Kuroiwa, N.

IC packaging continues to grow in complexity. The trend to smaller packaging with higher pin counts requires PWB (printed wiring board) technology to keep pace. The current answer to this continuing trend of component micro sizing is the emerging Microvia Technology. At IBIDEN we have dedicated our resources to the study of the technology and process capability of Microvia PWBs. We have achieved this goal by analyzing photo and laser via forming, subtractive and additive patterning and various combinations of base materials that exhibit specific physical characteristics

Published in:

Advanced Packaging Materials: Processes, Properties andInterfaces, 2000. Proceedings. International Symposium on

Date of Conference: